JPH0365918B2 - - Google Patents

Info

Publication number
JPH0365918B2
JPH0365918B2 JP60106271A JP10627185A JPH0365918B2 JP H0365918 B2 JPH0365918 B2 JP H0365918B2 JP 60106271 A JP60106271 A JP 60106271A JP 10627185 A JP10627185 A JP 10627185A JP H0365918 B2 JPH0365918 B2 JP H0365918B2
Authority
JP
Japan
Prior art keywords
plate
sheet
holding plate
chip
chip component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60106271A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61264787A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP60106271A priority Critical patent/JPS61264787A/ja
Publication of JPS61264787A publication Critical patent/JPS61264787A/ja
Publication of JPH0365918B2 publication Critical patent/JPH0365918B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68313—Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting

Landscapes

  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP60106271A 1985-05-17 1985-05-17 チツプ部品の保持プレ−ト Granted JPS61264787A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60106271A JPS61264787A (ja) 1985-05-17 1985-05-17 チツプ部品の保持プレ−ト

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60106271A JPS61264787A (ja) 1985-05-17 1985-05-17 チツプ部品の保持プレ−ト

Publications (2)

Publication Number Publication Date
JPS61264787A JPS61264787A (ja) 1986-11-22
JPH0365918B2 true JPH0365918B2 (en]) 1991-10-15

Family

ID=14429416

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60106271A Granted JPS61264787A (ja) 1985-05-17 1985-05-17 チツプ部品の保持プレ−ト

Country Status (1)

Country Link
JP (1) JPS61264787A (en])

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0738369B2 (ja) * 1988-12-12 1995-04-26 株式会社村田製作所 チップ部品の保持プレート
JPH083034Y2 (ja) * 1991-03-23 1996-01-29 太陽誘電株式会社 チップ状回路部品マウント装置用テンプレート

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5153259A (en]) * 1974-11-06 1976-05-11 Hitachi Ltd
JPS5653576U (en]) * 1979-10-02 1981-05-11
JPS591999Y2 (ja) * 1980-07-22 1984-01-19 東急車輌製造株式会社 粉粒体運搬車のベツセル下部排出構造

Also Published As

Publication number Publication date
JPS61264787A (ja) 1986-11-22

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term